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IBM Will Chip in on Micron's 3D Hybrid Memory Cube

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IBM Will Chip in on Micron's 3D Hybrid Memory Cube But where performance, space, and energy consumption are primary considerations, the HMCs could provide a much better TCO than traditional DDR technology. Certainly for the supercomputing community that is looking to achieve exascale computing with ... Прочитать новость полностью

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